Huawei’s Chip Dreams in Crosshairs of Latest U.S. Assault
The latest U.S. assault against Huawei Technologies Co. Ltd.
is aimed squarely at its HiSilicon chip design unit, a move that could force
the embattled company to sharply scale back or even abandon one of its most
promising businesses, analysts said.
On May 15, the U.S. Department of Commerce announced it
would expand a previous decision that had already cut off Huawei from its U.S.
suppliers unless they got permission from Washington. It said that rule not
only applied to Huawei’s U.S. suppliers and other business partners, but also
to any of Huawei’s foreign chip-making partners whose production lines include
U.S.-made equipment.
The new decision included a 120-day grace period, in which
chips from orders placed before May 15 can still be shipped to Huawei before
the end of the period. However, analysts expect Huawei’s chances of reaching a
deal with Washington could be low.
Although Washington didn’t provide more specifics, industry
lawyers believe that the move was specifically targeting chip manufacturers,
also known as foundries, such as global leader Taiwan Semiconductor
Manufacturing Co. (TSMC), that make Huawei-designed microchips under contract.
Most of Huawei’s chips currently go into its own products,
such as smartphones and telecom networking equipment. But some have said such
chips could also become a lucrative new business if it someday chooses to sell
them to outsiders.
To shield itself from the latest U.S. rule, Huawei could
still buy similar chips from non-U.S. third-party designers like Taiwan’s
MediaTek, even though that could hurt the quality of its offerings from 5G base
stations gear to smartphones, analysts said. But prospects for HiSilicon, which
has seen tremendous progress over the past few years, could be cast into
serious doubt, they added.
Chip sensation
Huawei’s major products include smartphones and telecom
networking equipment. Although it relies on third party chips to power most of
those, it has gradually built up a team to design chips, initially for in-house
use. That team at HiSilicon now has over 7,000 employees in offices around the
world, including in Singapore, South Korea, Japan and Europe, according to the
firm’s website.
China has made steady progress over the years in design of
chips, also called integrated circuits, with HiSilicon as one of the nation’s
leading players, said Jeff Pu, a Taiwan-based tech analyst at GF Securities.
The firm’s Kirin series chips for smartphones can now rival competitors like
global smartphone chip leader Qualcomm in various respects such as
connectivity, Pu said.
After Washington initially blacklisted Huawei last year,
barring it from buying U.S.-made chips from the likes of Qualcomm, Huawei
started sourcing more chips from HiSilicon, whose sales surged as a result.
The unit’s global sales grew 54% to $2.67 billion in the
first quarter of this year, with 90% coming from Huawei, according to a report
by IC Insights. By comparison, Huawei’s total revenue grew by a slower 19% to
858.8 billion yuan ($120 million) for all of last year. HiSilicon’s strong
growth helped it become the first Chinese mainland-based chipmaker to break
into the world’s top 10 in terms of sales, behind companies from the
traditional powerhouses of the U.S., South Korea and Taiwan.
Like many other chip designers, HiSilicon outsources the
actual manufacturing of its chips to contract chipmakers. TSMC, the world’s
largest and most advanced chip-making foundry, is HiSilicon’s biggest
manufacturing partner, accounting for 14% of the Taiwanese company’s sales in
the first quarter.
But the latest U.S. move has called the fabless production
model into question since TSMC is now likely to be barred from working with
HiSilicon without a U.S. government license.
“HiSilicon will basically cease to function if it loses
access to all fabs using U.S. equipment or if it can’t use the latest software
tools from the U.S.,” said Stewart Randall, a chip analyst at Shanghai-based
consultancy Intralink. U.S. companies now dominate industries for the advanced
equipment and software used to make high-tech microchips.
Partly anticipating tighter U.S. restrictions, Huawei has
been shifting some of its chip orders from TSMC to mainland-based Semiconductor
Manufacturing International Corp. (SMIC).
But SMIC may not be a reliable partner because it also
depends on U.S.-made chip manufacturing equipment and software, observers
pointed out. Many are speculating on whether SMIC will honor the U.S. rules, or
risk Washington’s wrath by supporting a hometown champion like Huawei.
If it were to choose the latter, SMIC could have difficulty
finding new suppliers in China. While the country has made progress in many
high tech areas, it is still limited in its capability to make advanced
manufacturing equipment and materials, said Chris Yim, a technology analyst at
BOCOM International.
Even if SMIC were willing to take the risk, it might not
help Huawei. The chipmaker’s technology is still far behind TSMC’s, said Szeho
Ng, a chip analyst at China Renaissance. TSMC is already engaged in 5-nanometer
production, while SMIC is still in 14-nanometer, he added, referring to a
chipmaker’s ability to make more advanced chips by making their circuits
smaller.
SMIC is trying to improve its capabilities by upgrading its
equipment, and earlier this month announced it had secured more than $2 billion
in new investment from two Chinese chip funds. Its current 14-nanometer
technology will be incapable of making chips that HiSilicon would need for
Huawei’s 5G phones set to enter mass production in the near future, said GF
Securities’ Pu.
Third-party suppliers
If it loses access to TSMC and SMIC, Huawei could still
procure chips that are not custom-made for the company from other third-party
suppliers, American export control lawyers told Caixin.
Huawei is already in talks with such companies, including
Taiwan’s MediaTek and the mainland’s UNISOC, as alternatives to keep its
consumer electronics business afloat if HiSilicon can no longer make its own
chips, Nikkei Asian Review reported earlier this month, citing anonymous
sources.
Procuring such non-customized chips would test Huawei’s
capabilities to integrate them into its products, and could also reduce their
performance, Pu said.
The U.S. actions could intensify pressure on Huawei from
elsewhere as well, as Washington pushes its allies to make similar moves. The
U.K. government has launched a review into Huawei to reevaluate the country’s
posture toward the Chinese company, and British officials have been asked to draft
a plan to reduce Huawei’s involvement in 5G to zero by 2023, Bloomberg
reported.
“You would expect more foreign governments announcing such
moves in the future,” said Pu.
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